Cutting - Wafer production equipment              
Sponsor Companies        
Name Region Revenue
€/2009

€/2008
No.Staff Equipment Types
45th Institute of CETC China 40-50 Cutting equipment, Wire saws
Applied Materials USA Cutting equipment, Wire saws
DECKER Germany 40 Silicon recovery system
Diamond Wire Technology USA Cutting equipment, Wire saws
DISEC S. Korea Wire saws
Ecoprogetti Italy 19 Cutting equipment
EO Technics S. Korea Cutting equipment, Diamond Wire Saw
Ferrotec Corporation Japan 181 Wire saws
Fonon DSS USA Diamond Wire Saw
Genauigkeits Maschinenbau Nürnberg Germany 50 Wire saws
Hanhong Precision Machinery China 300(400) Wire saws
HCT Switzerland 85 Cutting equipment, Wire saws
Herbert Arnold Germany 100 Band saws, Cutting equipment
HG Laser China 40(2000) Cutting equipment
Huasheng Tianlong Mechanical China 180 Band saws, Cutting equipment
Ishii Hyoki Japan *(406) Cutting equipment, Wire saws
JPSA Laser USA Diamond Wire Saw
Kaiyuan Solar China 300 Wire saws
Komatsu NTC Japan 693 Slurry recovery system, Wire saws
Kuka S-Base Czech Rep. 75(220) Cutting equipment, Wire saws
LOG-O-MATIC Germany Band saws, Cutting equipment, Diamond Wire Saw
M. Watanabe Japan 61 Slurry recovery system
Meyer Burger Switzerland 280 Band saws, Wire saws
Mössner Germany 85 Band saws
my-Chip Production Germany Diamond Wire Saw
Newport Corporation USA 200(2800) Diamond Wire Saw
Nissin Machine Tools China Wire saws
Samjung Engineering S. Korea 60(160) Wire saws
Sermas Industrie France 2(28) Band saws
SiGen USA Cutting equipment
Sunic Photoelectricity China 1m 100(157) Diamond Wire Saw
Tec-h China (200) Diamond Wire Saw
Tianhong Laser Equipment China 5m 20(150) Diamond Wire Saw
Tokyo Rope Japan Wire saws
Toyo Advanced Technologies Japan *(692) Wire saws
United Technology Japan Slurry recovery system
Wuhan Chutian China 280(1000) Diamond Wire Saw
Yasunaga Japan 677 Slurry recovery system, Wire saws
Zhejiang Jinding Saw Tools China Band saws

 



Solar Ingot / Wafer / Cell / Panel Equipment
  Main    
Ingot / Block production equipment
Turn-key System(2) Casting/Solidification(19) Puller(30)
Inspecting/Testing(15) Cutting & Grinding(9) Other(2)
Wafer production equipment
Turn-key system(9) Cutting(39) Cleaning(55)
Inspecting/Testing(65) Polishing & Grinding(8) Other(39)
Cell production equipment
Turn-key system(15) Etching(68) Cleaning(35)
Diffusion(40) Coating/Deposition(61) Screen printing(35)
Other furnaces(32) Inspecting/Testing(126) Cutting/Scribing (39)
Other(40)    
Crystalline Panel production equipment
Turn-key system(27) Inspecting/Testing(99) Cleaning(28)
Tabbing/Stringing(49) Laminating(63) Framing(35)
Other(78)    
Thin-film Panel Production Equipment
Turn-key system(38) Inspecting(38) Coating/Deposition(59)
Cutting/Scribing(43) Cleaning(10) Etching(23)

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