Companies )| Cutting - Wafer production equipment |
| Sponsor Companies | ||||
| Name | Region |
Revenue €/2009 €/2008 |
No.Staff | Equipment Types |
45th Institute of CETC
|
China | 40-50 | Cutting equipment, Wire saws | |
| Applied Materials | USA | Cutting equipment, Wire saws | ||
| DECKER | Germany | 40 | Silicon recovery system | |
| Diamond Wire Technology | USA | Cutting equipment, Wire saws | ||
| DISEC | S. Korea | Wire saws | ||
| Ecoprogetti | Italy | 19 | Cutting equipment | |
| EO Technics | S. Korea | Cutting equipment, Diamond Wire Saw | ||
| Ferrotec Corporation | Japan | 181 | Wire saws | |
| Fonon DSS | USA | Diamond Wire Saw | ||
| Genauigkeits Maschinenbau Nürnberg | Germany | 50 | Wire saws | |
| Hanhong Precision Machinery | China | 300(400) | Wire saws | |
| HCT | Switzerland | 85 | Cutting equipment, Wire saws | |
| Herbert Arnold | Germany | 100 | Band saws, Cutting equipment | |
| HG Laser | China | 40(2000) | Cutting equipment | |
| Huasheng Tianlong Mechanical | China | 180 | Band saws, Cutting equipment | |
| Ishii Hyoki | Japan | *(406) | Cutting equipment, Wire saws | |
| JPSA Laser | USA | Diamond Wire Saw | ||
| Kaiyuan Solar | China | 300 | Wire saws | |
| Komatsu NTC | Japan | 693 | Slurry recovery system, Wire saws | |
| Kuka S-Base | Czech Rep. | 75(220) | Cutting equipment, Wire saws | |
| LOG-O-MATIC | Germany | Band saws, Cutting equipment, Diamond Wire Saw | ||
| M. Watanabe | Japan | 61 | Slurry recovery system | |
| Meyer Burger | Switzerland | 280 | Band saws, Wire saws | |
| Mössner | Germany | 85 | Band saws | |
| my-Chip Production | Germany | Diamond Wire Saw | ||
| Newport Corporation | USA | 200(2800) | Diamond Wire Saw | |
| Nissin Machine Tools | China | Wire saws | ||
| Samjung Engineering | S. Korea | 60(160) | Wire saws | |
| Sermas Industrie | France | 2(28) | Band saws | |
| SiGen | USA | Cutting equipment | ||
| Sunic Photoelectricity | China | 1m | 100(157) | Diamond Wire Saw |
| Tec-h | China | (200) | Diamond Wire Saw | |
| Tianhong Laser Equipment | China | 5m | 20(150) | Diamond Wire Saw |
| Tokyo Rope | Japan | Wire saws | ||
| Toyo Advanced Technologies | Japan | *(692) | Wire saws | |
| United Technology | Japan | Slurry recovery system | ||
| Wuhan Chutian | China | 280(1000) | Diamond Wire Saw | |
| Yasunaga | Japan | 677 | Slurry recovery system, Wire saws | |
| Zhejiang Jinding Saw Tools | China | Band saws | ||
Solar Ingot / Wafer / Cell / Panel Equipment |
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