Cutting - Wafer Production Equipment              
Sponsor Companies        
Name Region Revenue
€/2009

€/2008
No.Staff Equipment Types
45th Institute of CETC China 40-50 Cutting equipment, Wire saws
48th Research Institute China 300 Wire saws
Applied Materials USA Cutting equipment, Wire saws
Decker Germany 50 Silicon recovery system
Diamond Wire Technology USA Cutting equipment, Wire saws, Diamond wire saws
DISEC S. Korea 30(180) Wire saws, Diamond wire saws
Ecoprogetti Italy 19 Cutting equipment
Ferrotec Corporation Japan 181 Wire saws
Genauigkeits Maschinenbau Nürnberg Germany 50 Wire saws
Hanhong Precision Machinery China 300(400) Wire saws
HCT Switzerland 85 Cutting equipment, Wire saws
Herbert Arnold Germany 100 Band saws, Cutting equipment
HG Laser China 40(2000) Cutting equipment
Ishii Hyoki Japan *(406) Cutting equipment, Wire saws
JCM Co.,Ltd. Japan 150 Band saws
JPSA Laser USA Cutting equipment
Kaiyuan Solar China 300 Wire saws
Komatsu NTC Japan 693 Slurry recovery system, Wire saws
Kuka S-Base Czech Rep. 75(220) Cutting equipment, Wire saws
Linton NC Machine China Cutting equipment
LOG-O-MATIC Germany Band saws, Cutting equipment, Diamond wire saws
Logitech UK Wire saws
M. Watanabe Japan 61 Slurry recovery system
Meyer Burger Switzerland 280 Band saws, Wire saws, Diamond wire saws
Mössner Germany 85 Band saws
my-Chip Production Germany Diamond wire saws
Nissin Machine Tools China Wire saws, Diamond wire saws
Samjung Green Tech S. Korea 60(160) Wire saws
SiGen USA Cutting equipment
Takatori Corporation Japan Wire saws
Tianlong Photoelectric China 180 Band saws, Cutting equipment
Tokyo Rope Japan Wire saws
Toyo Advanced Technologies Japan *(692) Wire saws, Diamond wire saws
United Technology Japan Slurry recovery system
Well Diamond Wire Saws Switzerland Diamond wire saws
Yasunaga Japan 677 Slurry recovery system, Wire saws
Yujing Machine Industrial China Wire saws, Diamond wire saws
Zhejiang Jinding Saw Tools China Band saws

 



Solar Ingot / Wafer / Cell / Panel Equipment
  Main    
Ingot / Block Production Equipment
Turn-Key System(3) Crystalline Ingot Growing(45) Inspecting/Testing(19)
Cutting & Grinding(11) Other(3)  
Wafer Production Equipment
Turn-Key System(11) Cutting(38) Cleaning(50)
Inspecting/Testing(68) Polishing & Grinding(8) Other(47)
Cell Production Equipment
Turn-Key System(18) Etching(77) Diffusion(41)
Coating/Deposition(62) Screen Printing(33) Other Furnaces(32)
Inspecting/Testing(134) Other(44)  
Crystalline Panel Production Equipment
Turn-Key System(38) Inspecting/Testing(118) Cleaning(35)
Tabbing/Stringing(59) Laminating(82) Cutting/Scribing(38)
Framing(47) Other(96)  
Thin-Film Panel Production Equipment
Turn-Key System(28) Inspecting(46) Coating/Deposition(70)
Cutting/Scribing(40) Cleaning(4) Etching(25)

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