Home
 Cutting - Wafer Production Equipment              
Sponsor Companies      
Name Region No.Staff Equipment Types
45th Institute of CETC China 950 Cutting equipment, Wire saws
48th Research Institute China 1000 Wire saws
Adted Plasma Japan Wire saws
Andosaw Japan Band saws
Applied Materials USA Cutting equipment, Wire saws
ATV Technologie Germany Diamond wire saws
BESTSUN China Cutting equipment
Crystal Systems USA Cutting equipment
Decker Germany 50 Silicon recovery system
Diamond Wire Technology USA Cutting equipment, Wire saws, Diamond wire saws
DISEC S. Korea 180 Wire saws, Diamond wire saws
EMB Germany Cutting equipment
Energy Equipment Testing UK 8 Cutting equipment
Forefront Automation Canada 70 Cutting equipment
Fujian Rujing New Energy Equipment China 100 Diamond wire saws
GEA Westfalia Separator Group Germany 3000 Slurry recovery system
Genauigkeits Maschinenbau Nürnberg Germany 50 Wire saws
Haimeng New Energy Technology Development China 200 Cutting equipment
HCT Switzerland 85 Cutting equipment, Wire saws
Herbert Arnold Germany 100 Band saws, Cutting equipment, Wire saws
HG Laser China 2,000 Cutting equipment
Ishii Hyoki Japan 407 Cutting equipment, Wire saws
Jing long Sun Equipment China 320 Cutting equipment
JPSA Laser USA Cutting equipment
Kaiyuan Solar China 300 Band saws, Wire saws
Komatsu NTC Japan 693 Cutting equipment, Wire saws
Kuka S-Base Czech Rep. 50 Band saws, Cutting equipment, Wire saws
Linton PV&SEMI Machine China Cutting equipment
LOG-O-MATIC Germany Band saws, Cutting equipment, Diamond wire saws
Logitech UK Wire saws
LZ Rapid Group China Wire saws
M. Watanabe Japan 61 Slurry recovery system
Meyer Burger Switzerland 600 Band saws, Wire saws, Diamond wire saws
Miyachi Unitek USA Cutting equipment
Mössner Germany 85 Band saws, Cutting equipment
MTI Corporation USA Band saws, Cutting equipment, Diamond wire saws
my-Chip Production Germany Diamond wire saws
N. BUCHER Switzerland Wire saws
Nissin Machine Tools China Wire saws, Diamond wire saws
NV Bekaert Belgium Band saws
Op-tection Germany Cutting equipment
PASS China 100 Cutting equipment
Samjung Green Tech S. Korea 160 Wire saws
Sanchao Diamond China 100 Diamond wire saws
Shangji Grinding Machine China Band saws
SiGen USA Cutting equipment
Solar Semi Engineering UK Cutting equipment
Sonobongd Ultrasonics USA Cutting equipment
Suzhou HRT China 300 Cutting equipment
Takatori Corporation Japan 200 Cutting equipment, Wire saws
THEMIS Czech Rep. Wire saws
Tianlong Photoelectric China 180 Cutting equipment, Wire saws
Tokyo Rope Japan Wire saws
Toyo Advanced Technologies Japan 692 Diamond wire saws
Ulrich Rotte Germany Cutting equipment
United Technology Japan Slurry recovery system
Well Diamond Wire Saws Switzerland Diamond wire saws
WinFox Machinery China Band saws, Cutting equipment
Wuxi Jiangsong S & T China Cutting equipment
Xinyu Yinlong Jidian China Wire saws
Yasunaga Japan 677 Wire saws
Yujing Machine Industrial China Wire saws, Diamond wire saws
Zhejiang Jinding Saw Tools China Band saws, Cutting equipment

 



Solar Ingot / Wafer / Cell / Panel Equipment
  Main    
Ingot / Block Production Equipment
Turn-Key System(1) Crystalline Ingot Growing(58) Inspecting/Testing(30)
Cutting & Grinding(22) Other(8)  
Wafer Production Equipment
Turn-Key System(13) Cutting(63) Cleaning(89)
Inspecting/Testing(97) Polishing & Grinding(16) Other(75)
Cell Production Equipment
Turn-Key System(16) Etching(102) Diffusion(55)
Coating/Deposition(97) Screen Printing(40) Other Furnaces(53)
Inspecting/Testing(181) Other(51)  
Crystalline Panel Production Equipment
Turn-Key System(54) Inspecting/Testing(183) Cleaning(50)
Tabbing/Stringing(81) Laminating(116) Cutting/Scribing(61)
Framing(74) Other(130)  
Thin-Film Panel Production Equipment
Turn-Key System(45) Inspecting(67) Coating/Deposition(82)
Cutting/Scribing(49) Cleaning(10) Etching(33)

© 2005-2012  ENF Ltd.  All Rights Reserved