Polishing & Grinding - Wafer production equipment              
Sponsor Companies        
45th Institute of CETC China 40-50 Wafer grinding equipment
Name Region Revenue
€/2009

€/2008
No.Staff Equipment Types
45th Institute of CETC China 40-50 Wafer grinding equipment
Applied Materials USA Wafer polishing machine
Genauigkeits Maschinenbau Nürnberg Germany 50 Wafer grinding equipment
GigaMat USA 57 Wafer polishing machine
Herbert Arnold Germany 100 Wafer grinding equipment
Ishii Hyoki Japan *(406) Wafer polishing machine
Nissin Machine Tools China Wafer grinding equipment
Yujing Machine Industrial China Wafer grinding equipment, Wafer polishing machine

 



Solar Ingot / Wafer / Cell / Panel Equipment
  Main    
Ingot / Block production equipment
Turn-key System(2) Casting/Solidification(19) Puller(30)
Inspecting/Testing(15) Cutting & Grinding(9) Other(2)
Wafer production equipment
Turn-key system(9) Cutting(39) Cleaning(55)
Inspecting/Testing(65) Polishing & Grinding(8) Other(40)
Cell production equipment
Turn-key system(15) Etching(68) Cleaning(35)
Diffusion(40) Coating/Deposition(61) Screen printing(34)
Other furnaces(33) Inspecting/Testing(126) Cutting/Scribing (39)
Other(40)    
Crystalline Panel production equipment
Turn-key system(27) Inspecting/Testing(101) Cleaning(28)
Tabbing/Stringing(49) Laminating(65) Framing(35)
Other(79)    
Thin-film Panel Production Equipment
Turn-key system(38) Inspecting(38) Coating/Deposition(59)
Cutting/Scribing(43) Cleaning(10) Etching(23)

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