Polishing & Grinding - Wafer Production Equipment              
Sponsor Companies      
Name Region No.Staff Equipment Types
45th Institute of CETC China 950 Wafer grinding equipment
Amtech Systems, Inc. USA Wafer polishing machine
Applied Materials USA Wafer polishing machine
DIKEMA PRECISION China 200 Wafer grinding equipment, Wafer polishing machine
Genauigkeits Maschinenbau Nürnberg Germany 50 Wafer grinding equipment, Wafer polishing machine
GigaMat USA 5855 Wafer grinding equipment, Wafer polishing machine
Herbert Arnold Germany 100 Wafer grinding equipment
Ishii Hyoki Japan 407 Wafer polishing machine
Komatsu Japan 820 Wafer grinding equipment
Logitech UK Wafer polishing machine
LZ Rapid Group China Wafer grinding equipment, Wafer polishing machine
MIC Taiwan Wafer grinding equipment
MTI Corporation USA Wafer polishing machine
my-Chip Production Germany Wafer grinding equipment, Wafer polishing machine
Wafab International USA Wafer polishing machine
Yujing Machine Industrial China Wafer grinding equipment, Wafer polishing machine

 



Solar Ingot / Wafer / Cell / Panel Equipment
  Main    
Ingot / Block Production Equipment
Turn-Key System(1) Crystalline Ingot Growing(58) Inspecting/Testing(30)
Cutting & Grinding(22) Other(8)  
Wafer Production Equipment
Turn-Key System(13) Cutting(63) Cleaning(89)
Inspecting/Testing(97) Polishing & Grinding(16) Other(75)
Cell Production Equipment
Turn-Key System(16) Etching(102) Diffusion(55)
Coating/Deposition(97) Screen Printing(40) Other Furnaces(53)
Inspecting/Testing(181) Other(51)  
Crystalline Panel Production Equipment
Turn-Key System(54) Inspecting/Testing(183) Cleaning(50)
Tabbing/Stringing(81) Laminating(116) Cutting/Scribing(61)
Framing(74) Other(130)  
Thin-Film Panel Production Equipment
Turn-Key System(45) Inspecting(67) Coating/Deposition(82)
Cutting/Scribing(49) Cleaning(10) Etching(33)

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