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Sputtering Target - Thin Film Panel Process

Sponsor Companies
Name	Region	Revenue €/2009 €/2008	No.Staff	Material Types
Academy Group	USA		11(198)	Sputtering target
Advanced Nano Products	S. Korea			Sputtering target
Angstrom Sciences	USA		37	Sputtering target
AT&M	China		100(2000)	Sputtering target
Beijing Hezongtianqi	China			Sputtering target
Bekaert Advanced Coatings	Belgium			Sputtering target
Ceradyne	USA			Sputtering target
China Tin Group	China			Sputtering target
CNMC (Ningxia) Orient Group	China			Sputtering target
GfE Fremat GmbH	Germany			Sputtering target
GRINM	China			Sputtering target
H.C. Starck	Germany			Sputtering target
Heraeus	Germany			Sputtering target
Indium Corporation	USA			Sputtering target
Jinrui Rare Meta	China			Sputtering target
Omat Sputtering	China		150(450)	Sputtering target
Pioneer Materials Chengdu	China			Sputtering target
Plansee	Austria			Sputtering target
Praxair	USA			Sputtering target
Process Materials	USA			Sputtering target
ProTech Materials	USA			Sputtering target
Robeko	Germany			Sputtering target
SCI Engineered Materials	USA			Sputtering target
Shanghai Shuosong	China		50(100)	Sputtering target
Silfex	USA			Sputtering target
Sindlhauser Materials	Germany			Sputtering target
Solar Applied Materials	China			Sputtering target
Soleras	USA			Sputtering target
Sujing Electronic Material	China			Sputtering target
Targray Technology	Canada			Sputtering target
Testbourne	UK			Sputtering target
Thermal Conductive Bonding	USA			Sputtering target
Thintech Materials	Taiwan		*(200)	Sputtering target
TMTECH	S. Korea			Sputtering target
Tosoh Corporation	Japan			Sputtering target
Umicore	Belgium			Sputtering target
Wieland	Germany			Sputtering target
Williams Advanced Materials	USA			Sputtering target
Yansheng Applied Materials	China			Sputtering target

 

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Solar Materials
	Main
Ingot/Block Process Polysilicon(74) Polysilicon (Upcoming Producers)(52) Recycled Material(11) Crucible(87) Carbon Felt(23) Other(4) Wafer Process Ingot/Block(205) Saw Band (9) Slurry(75) Saw Wire(10) Ingot Mounting Adhesives(12) Acids(33) Cell Process Wafer(203) Metallization Paste(43) Screen(31) Ammonia(14) Isopropyl Alcohol(19) Phosphorus-oxychloride(13) Silane(16) Acids(33) Hydroxide(14) Crystalline Panel Process Cell(234) Ribbon(72) Glass(70) Film(112) Cable(88) Junction Box(84) Connector(77) Frame(54) Other(65) Thin Film Panel Process Glass(70) Film(112) Cable(88) Junction Box(84) Connector(77) Frame(54) TCO Material(3) Sputtering Target(39) Alumina(3) Boron(6) Cadmium Sulfide(4) Copper(7) Gallium(26) Germanium(21) Indium(31) Molybdenum(21) Phosphorus-oxychloride(13) Silane(16) Tellurium(24) Tin(6) Oxides(12) Acids(33) Other(65)