Cassette, Système de manipulation de wafer, Equipement pour la séparation des wafers, Chaîne de production de Wafer clé en main, Nettoyage ultrasonic pour wafer, Trieuse Wafer

Cassette, Ligne de metalisation pour cellules, Equipement de gravure à l'eau forte, Equipement de texturisation, Equipement de gravure chimique

Nettoyage ultrasonique pour panneaux

Sputtering pour couche mince, Revêtement AR pour couche mince, Nettoyage ultrasonique pour couche mince, Equipement de gravure chimique pour couche mince

Inline saw damage etching and texturing

The InTex system reomves the surface damage induced by the sawing process and at the same time imporoves the light trapping into the cell by texturing the surface of the wafer. The InTex series has set the standard for inline swa damage etching and texturing in the PV industry.

Areas of application

• Saw damage etching and texturing of solar cells
• Designed for multi- and monocrystalline wafers
• Wafer transfer systems available for automatic loading and unloading

Features and benefits

• Optimised total cost of ownership
• Surface texture tunable to optimise reflection and defect etching to reach best process integration in the complete line
• Optimised fluid dynamics for best process performance and homogeneity
• Technological leadership
  • Process start up by RENA
  • Proven process performance
  • Homogeneous textured surface
  • Best process yield
• Small footpring

Technical Data InTex

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	InTex ST	InTex HT
Process	5 lanes for 156 mm wafers Inline saw damage removal and texturing of solar cells	5 lanes for 156 mm wafers Inline saw damage removal and texturing of solar cells
Dimensions	8400 x 2150 x 2350 mm (lenth x width x height)	10200 x 2150 x 2350 mm (lenth x width x height)
Throughput	1875 wafers/h gross wafer size 156 mm	3600 wafers/h gross wafer size 156 mm
Wafer thickness	> 150μm	> 150μm