Apparecchiatura per il taglio, Seghe a cavo, Lavatrici ad ultrasuoni per wafer, Tester dei Wafer, Apparecchiature per levigatura

Apparecchiature per la levigatura/incisione a liquido, Stampante serigrafica

Cell laser scriber/cutter

Thin-film mechanical scriber

DXQ-601 Multi-Wire Saw

DXQ-601 Multi-wire Saw is used to cutting solar energy silicon wafer and all kinds of major diameter semi-conductor material. The cutting wafer has low BOW and WARP and well TAPER and TTV. It can reduce cutting edge waste. Wafer surface damage is shallow, wafer surface roughness lower. The equipment has high cutting efficiency. It has single direction and double direction cutting function. It can inspect break wire real time during cutting.

Main Features

• Main Shaft Unit

Main Shaft: Adopt high precision axis bearing; it has high precision and lower radiation and long life.
Adopt cooling water technique. Adopt airproof technique. Adopt conical surface orientation technique. Ensure main shaft has high radical and axis precision.

• Main Roller Unit

Roller unit: Adopt high precision orientation design and precision machining. Ensure the roller has high radical precision and lower coaxial error. Adopt high performance wear well material to cover the roller surface. And groove in high precision. Ensure wafer cutting precision.
Roller diameter: Φ 190-200mm

• Worktable Unit

Worktable unit: Adopt high precision line guide rail and ball screw structure. Through special design ensure high linearity. Adopt high precision reduction gear to ensure low feed speed stability.
Feed speed: 0.1-2.5 mm/min
Return speed: 50-500 mm/min

• Slurry Cooling System

Slurry cooling system: Adopt heat exchanger to cooling slurry temperature and inspect slurry density and flow and temperature. Ensure slurry temperature stability during cutting and ensure cutting precision.
Slurry temperature control range: ±1°C

• Slurry Supply Unit

Slurry supply unit: Adopt transducer to control slurry bump rotation. Through inspect slurry flow change to closed loop control slurry flow. Ensure slurry flow stability.
Slurry pump flow: >70L/min
Slurry capacity: 175L

• Tension Control System

Wire tension control system: Adopt high precision wire tension sensor to inspect cutting wire tension change in time. Through wire tension adjust device to adjust wire tension value in time. Tension control system ensure tension control precision between ±2N range. The stability tension control can ensure wafer cutting quality.
Tension control precision: ±2N

• Winding Reel System

Winding reel system: Adopt high precision bearing. Through high precision machining ensure reel shaft has high redical precision and lower coaxial error. Adopt Siemens motor and control system to ensure winding and rewinding reel run synchronizing and has high response time.

• Cutting Wire Auto Range System

Cutting wire auto range system: Adopt high precision inspect sensor and racks of gearing and line guide rail and servo system. Ensure winding evenness. The sideslip table move in synchronism with reel winding ensure lining and stability. Through sensor inspection compensating wire position automatically, to ensure winding consistency.

• High Precision Motion Control System

High precision motion control system: Adopt embed controller and motion control card to realize main shaft rotation speed, reel speed, the tension's arm torque and feed worktable and auto winding control. It can inspect tension sensor sign too. Adopt motion control system can improve control precision and response time.

• Friendly Software Interface

The equipment has friendly software interface, easy operation, the parameter set is simple .cutting state and fault alarm can show in time. short-term training to attain favorable effect. It has auto and manual operation mode.

Main Specifications

Max figure dimension:	Square wafer: 156×156×300(mm)×2
	Round wafer: Φ 150×300(mm)×2
Wire diameter:	0.1-0.18mm
Line speed:	1000m/min(Max)
Roller diameter:	Φ 190-200mm
Wire storage:	Φ 0.14×300Km
Worktable max range:	240mm
Worktable return speed:	50-500mm/min
Worktable feed speed:	0.1-2.5mm/min
Wire tension:	10-50N
Slurry flux:	>70L/min
Power supply:	AC380V±38V 50Hz±1Hz
Max power:	95KW
Air supply:	>0.4Kgf/cm3
Equipment figure:	2660(L)×1850(W)×2720(H)(mm)
Weight:	6000kg