ホーム
  RENA GmbH
  所在地: Ob der Eck 5, D-78148 Gütenbach. Germany
  ウェブサイト: www.rena.com
電話: +49 77239313-0
FAX: +49 77239313-50
E-mail: inforena.com
  従業員数 1300
  設備タイプ
カセット, ウェハース取り扱いシステム, ウェハ分離装置, ターンキーの生産ライン, ウェハー超音波洗浄装置, ウェハーソーター
カセット, 太陽電池成膜装置, エッチング設備, 粗面加工設備, ウェットエッチング装置
ガラス洗浄装置
薄膜モジュールスパッタリング装置, 薄膜モジュールARコーティング, 薄膜モジュール超音波洗浄装置, 薄膜モジュールウェットエッチング装置
  親会社 --
  問屋 Correns Corporation(Japan)
  付加の情報(広告) Wet Process – complete solutions for inline and batch processing

From process development to manufacturing of equipment and final acceptance – RENA products cover the full range of wet processing for the solar industry, including handling, transport and measurement solutions. Driven by extensive research and development RENA improves the wet processing steps for solar wafer and solar cell production. This engagement for higher yields by increasing the efficiency and reducing the demand of raw material enables RENA to provide a new generation of process solutions.
製品
(広告)		 Solar Power srl

Inline saw damage etching and texturing

The InTex system reomves the surface damage induced by the sawing process and at the same time imporoves the light trapping into the cell by texturing the surface of the wafer. The InTex series has set the standard for inline swa damage etching and texturing in the PV industry.

Areas of application

  • Saw damage etching and texturing of solar cells
  • Designed for multi- and monocrystalline wafers
  • Wafer transfer systems available for automatic loading and unloading

Features and benefits

  • Optimised total cost of ownership
  • Surface texture tunable to optimise reflection and defect etching to reach best process integration in the complete line
  • Optimised fluid dynamics for best process performance and homogeneity
  • Technological leadership
    • Process start up by RENA
    • Proven process performance
    • Homogeneous textured surface
    • Best process yield
  • Small footpring


Technical Data InTex

InTex ST InTex HT
Process 5 lanes for 156 mm wafers
Inline saw damage removal and
texturing of solar cells		 5 lanes for 156 mm wafers
Inline saw damage removal and
texturing of solar cells
Dimensions 8400 x 2150 x 2350 mm
(lenth x width x height)		 10200 x 2150 x 2350 mm
(lenth x width x height)
Throughput 1875 wafers/h gross
wafer size 156 mm		 3600 wafers/h gross
wafer size 156 mm
Wafer thickness > 150μm > 150μm
  最後更新 09-05-2012  
© 2005-2012  ENF Ltd.  All Rights Reserved