48th Research Institute of China Electronics Technology Group Corporation
  Address: No.1025 New Kaipu Road, Tianxin District, ChangSha, Hunan. China
  Website: www.cs48.com
Phone:
+86 731 85401880
Fax:
+86 731 85401890
E-mail:
service48cs48.com
  Number of Staff 1000
  Equipment Types
MCZ method, DSS method
Wire saws
Plasma etching equipment, Texturing equipment, Diffusion furnace, Cell PECVD , Screen printer, Drying furnace, Firing furnace, Cell sorter
  Parent Company China Electronics Tecknology Group Corporation
  Key Customers aleo solar AG, auroPOWER GmbH, BEHLAU ENERGIE GRUPPE, CENTROSOLAR AG, Conergy AG
  Products
Model No.CZ800A puller : CZ800A
Click to enlarge
Power Supply187.5 kW
Main Chamber SizeΦ800x800 mm
Polysilicon Charge Capacity60 kg
Ingot Diameter6-8 mm
Seed Lift Rate0.1-10 mm/hr
Effective Vertical Travel Of Seed2650 mm
Crucible Rotation0-30 rpm
Effective Vertical Travel Of Crucible380 mm
Model No.CZ900A puller : CZ900A
Click to enlarge
Power Supply187.5 kW
Main Chamber SizeΦ900x850 mm
Polysilicon Charge Capacity90 kg
Ingot Diameter6-8 mm
Seed Lift Rate0.1-10 mm/hr
Effective Vertical Travel Of Seed3000 mm
Crucible Rotation0-30 rpm
Effective Vertical Travel Of Crucible400 mm
Model No.R13240-1 casting_furnace : R13240-1
Click to enlarge
Power Supply Of Heating System200 KVA
Cycle Time50 hr
Max Operating Temperature1600 C
Charge Capacity240-270 kg
Standard Ingot Size690x690x22 mm
Growth Rate20 mm/hr
Standard Ingot Weight240-270 kg
Gas Consumption1~1.4 m3/hr
Ultimate Vaccum Pressure2 Pa
Cooling Water Consumtion1~140 I/min
Model No.R13450-1 casting_furnace : R13450-1
Click to enlarge
Power Supply Of Heating System200 KVA
Cycle Time60 hr
Max Operating Temperature1600 C
Charge Capacity450-450 kg
Standard Ingot Size846x846x270 mm
Growth Rate20 mm/hr
Standard Ingot Weight450 kg
Gas Consumption1.2~1.4 m3/hr
Ultimate Vaccum Pressure2 Pa
Cooling Water Consumtion1~140 I/min
Model No.Multi-wire Sawing Machine wire_saw : Multi-wire Sawing Machine
Click to enlarge
Max Work Piece Dimension200x200x300 mm
Wire Length300 km
Max Wire Speed1~17 m/sec
Table Feed Rate42 μm/sec
Thickness Of Wafer200 μm
  Last Update 17-11-2011  
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