Companies ) |
No.45 Research Institute of China Electronics Technology Group Corp. |
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cetc-45inst.com| Number of Staff | 950 | ||||||||||||||||||||||||||||||||
| Equipment Types |
Cutting equipment, Wire saws, Ultrasonic wafer cleaner, Wafer tester, Wafer grinding equipment
Wet etching equipment, Screen printer
Cell laser scriber/cutter
Thin-film mechanical scriber
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| Parent Company | -- | ||||||||||||||||||||||||||||||||
| Additional
info (Advertising) |
The 45th Research Institute of CETC is involved in the research and development of specialized semiconductor equipment technology, machine systems and implementation techniques, and the manufacturing of related equipment. Our company employs a team of professional research and development personnel. By applying our company’s outstanding human resources, leading core technologies and stringent quality control systems, we can provide our customers with holistic solutions to their manufacturing needs. | ||||||||||||||||||||||||||||||||
| Products (Advertising) |
DXQ-601 Multi-Wire SawDXQ-601 Multi-wire Saw is used to cutting solar energy silicon wafer and all kinds of major diameter semi-conductor material. The cutting wafer has low BOW and WARP and well TAPER and TTV. It can reduce cutting edge waste. Wafer surface damage is shallow, wafer surface roughness lower. The equipment has high cutting efficiency. It has single direction and double direction cutting function. It can inspect break wire real time during cutting. 
Main Features• Main Shaft UnitMain Shaft: Adopt high precision axis bearing; it has high precision and lower radiation and long life. • Main Roller UnitRoller unit: Adopt high precision orientation design and precision machining. Ensure the roller has high radical precision and lower coaxial error. Adopt high performance wear well material to cover the roller surface. And groove in high precision. Ensure wafer cutting precision. • Worktable UnitWorktable unit: Adopt high precision line guide rail and ball screw structure. Through special design ensure high linearity. Adopt high precision reduction gear to ensure low feed speed stability. • Slurry Cooling SystemSlurry cooling system: Adopt heat exchanger to cooling slurry temperature and inspect slurry density and flow and temperature. Ensure slurry temperature stability during cutting and ensure cutting precision. • Slurry Supply UnitSlurry supply unit: Adopt transducer to control slurry bump rotation. Through inspect slurry flow change to closed loop control slurry flow. Ensure slurry flow stability. • Tension Control SystemWire tension control system: Adopt high precision wire tension sensor to inspect cutting wire tension change in time. Through wire tension adjust device to adjust wire tension value in time. Tension control system ensure tension control precision between ±2N range. The stability tension control can ensure wafer cutting quality. • Winding Reel SystemWinding reel system: Adopt high precision bearing. Through high precision machining ensure reel shaft has high redical precision and lower coaxial error. Adopt Siemens motor and control system to ensure winding and rewinding reel run synchronizing and has high response time. • Cutting Wire Auto Range SystemCutting wire auto range system: Adopt high precision inspect sensor and racks of gearing and line guide rail and servo system. Ensure winding evenness. The sideslip table move in synchronism with reel winding ensure lining and stability. Through sensor inspection compensating wire position automatically, to ensure winding consistency. • High Precision Motion Control SystemHigh precision motion control system: Adopt embed controller and motion control card to realize main shaft rotation speed, reel speed, the tension's arm torque and feed worktable and auto winding control. It can inspect tension sensor sign too. Adopt motion control system can improve control precision and response time. • Friendly Software InterfaceThe equipment has friendly software interface, easy operation, the parameter set is simple .cutting state and fault alarm can show in time. short-term training to attain favorable effect. It has auto and manual operation mode. Main Specifications
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| Last Update | 26-10-2011 | ||||||||||||||||||||||||||||||||